Rigid / Rigid - HDI RF - Microwave

  • Multilayer SBU 3+N+3 Cu filled

    Application: Video Wall-Infotainment
    Technology: Multilayer SBU with 3+N+3 with Cu filled stacked vias burried filled & Capped vias
    Material: FR4 High TG with filler Iteq IT180A
    Finishing: Black solder mask and Enepig

  • Multilayer 14 layer mixed layup

    Application: Military radar
    Technology: Multilayer 14 layer mixed layup
    Material: FR4 High TG Iteq IT180 + Rogers RO3035 (Taconic RF35A2)
    Via sequence: L1-L2, L1-L4 L1-L12 L1-L14 and cavity L2-L14
    Finishing: Enig + Bondable 3 um plated gold

  • Multilayer 10 layer SBU 3+N+3 Laser vias

    Application: Renewable Energy
    Technology: Multilayer 10 layer SBU with 3+N+3 with Laser vias
    Material: Low DK & DF material Isola Fr408HR High
    Finishing: Enig

  • Multilayer 8 layer mixed layup

    Application: Telecom
    Technology: Multilayer 8 layer mixed layup Via Filled and capped, back drilled hole
    Material: FR4 High TG with filler + Rogers RO4350. Via Filled and capped, back drilled hole
    Finishing: Enig

  • Multilayer 6 layer laser via and UBGA

    Application: Medical
    Technology: Multilayer 6 layer with laser via and UBGA pitch 0.4 mm via in pad resin filled
    Material: FR4 High TG with filler Nelco N4000-29
    Finishing: Blue solder mask and Enig