MATERIALI DI BASE

Cistelaier S.p.A. mette a disposizione dei propri Clienti una vasta scelta di materiali, dal FR4 standard fino a materiali digitali ad alta velocità e HDI, prodotti anche nella versione Halogen Free:

•FR4 standard & Leadfree: Iteq IT140 & IT588; Isola Duraver ML104i - Tg 140 °C; Black FR4
•Mid Tg epoxy for Lead-free process: Iteq IT158 -Tg 160 °C ; Isola IS400 -Tg 150 °C
•Mid Tg– Halogen Free: Iteq IT40G -Tg 140 °C, IT150G;
•High Tg 180°C epoxy (without filler): Iteq IT180 (also No/Low flow Prepreg); Isola IS420& IS410; ARLON 45N
•High Tg 180°C epoxy (with filler): Iteq IT180A & IT180i; Isola PCL370HR; Nelco N4000-29 ; Hitachi 700GR; EMC 827 i
•High Tg 170°C epoxy – Halogen Free: Iteq IT170GRA1 & IT170G & IT180GN
•High speed application: Nelco N4000-13(Si) & N4800-20(Si); Isola Fr408HR, IS600 (series), I-Tera, Tachyon and Astra; Iteq IT200DK and IT150DA(SE), IT-968 (SE), IT-968G, IT-988G, IT-988G SE; Panasonic Megtron6 and Megtron7
•Capacitance layer: OAK-Mitsui Faradflex

Materiali ad alta prestazioni per applicazioni avionico/militari:

•Polyimide Resin System: Arlon 33N, 35N, 84N, 85N, 85HP; Ventec VT901(also No/Low flow); Hitachi MCL-I-671; Isola 95P/96P; NELTEC N 7000VO
•Epoxy Resin System: Arlon^® Kevlar 4NK (Tg 170 °C and 4.7 ppm/°C)
•Epoxy and Polyimide Thermount^® & Para Aramid fiber: ARLON^® 55NT/85NT
•Copper/Invar/Copper : tipically 150 µm thick - 17/120/17 µm)
•Thick copper: up to 500 microns and over, for BusBar application and copper inlay&coin technology

Substrati di copertura al Kapton® per circuiti flessibili:

•Flexible Laminates-Polyimide film based: DuPont PYRALUX LF; PYRALUX FR;
•Flexible Laminates- Polyimide film based Adhesiveless: PYRALUX AP, PYRALUX AP-Plus & PYRALUX TK
•Flexible Laminates-Polyimide based Adhesiveless: UBE Upilex 25-50-75 µm; Iteq 25-50-75-100 µm; Panasonic 25-50-75-100-125-150 µm; ThinFlex 25-50-75-100-125-150 µm
•Emi shielding layer: Tatsuta SF-PC6000 and TATSUTA SF-PC 3300

Materiali ad alta frequenza a base di Teflon® e non a base di Teflon®:

   •Rogers^® / Arlon(also Copper/Brass supported) :RT/Duroid Family ; RO3000 Family; TMM Family; DiClad Family; Isoclad Family; Cuclad Family; AD Family; AR Family; TC Family
•Rogers^® / Arlon^®: RO4350 & RO4003 (Back up material for discontinued 25N & 25FR but partially applicable), RO4360G2 and RO4400 bondply
•Iteq “new generation” material for RF and Microvawe applications IT-88GMW, IT-8300GA, IT-8338G, IT-8338A, IT-8350G, IT-8350A, IT-8615G with Dk from 3,00 up to 6,15 (6,05)
•Isola: IS600(Series), Astra MT77, I-tera and TerraGreen
•Taconic^®: RF25A2, RF35, RF35A2, RF45, RF60, TSM-DS3, Cer10, FastRise, TACLAM Plus and all teflon family (TLX, TLY, TLE)
•Nelco: Mercurywave series,Meteorwave (1000 & 4000 Series) and all teflon family
•Foam: Rohacel HF51