Multilayer

Multilayer PCBs.

The need to have multiple functions in the same electronic device has made it essential to incorporate “more electronics” into printed circuit boards.

This trend has sped up miniaturisation of electronic components and promoted the development of multilayer PCBs.

A greater quantity of copper layers means more interconnections are possible. Together with more complex electronics, this translates to additional functions.

Multilayer PCBs accommodate a wide variety of needs which is why they are the most popular, along with double-sided printed circuit boards.

Multilayer

Our expertise and the technology we use allow us to produce multilayer PCBs with over 40 layers of copper with more than 100 different materials.

Contact us for more information

All materials

CASE

Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm

Multilayer 9 layers 855 mm

  • Markets: Military Radar Ground radar Sea radar
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 9 layers 2 flex layers 500 micron Copper busbar HDI Controlled impedance Laser vias Buried vias 855 mm length ENIG Green Solder Mask
  • Materials: FR4 High Tg Adhesiveless polyimide film
24 layer, 640 mm long x 4.20 mm thickness 24 layer, 640 mm long x 4.20 mm thickness 24 layer, 640 mm long x 4.20 mm thickness

24 layers, 640 mm long x 4.20 mm thickness

  • Markets: Military Avionic radar
  • PCB Typology: Multilayer
  • Solutions: Power management
  • Technologies: 24 layers Mixed Copper thickness Laser vias Filled & capped vias 640 mm lenght 4.20 mm thickness ENIG Green Solder Mask
  • Materials: FR4 High Tg Iteq IT180A
Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch

Ml8–Logic + power on same PCB with fine pitch

  • Markets: Automotive hybrid car
  • PCB Typology: Multilayer
  • Solutions: Logic & power PCB
  • Technologies: 18 layers Mixed Copper thickness Fine pitch ENIG Green Solder Mask
  • Materials: FR4 High Tg Iteq IT180A
Multistrato rigido, 14 strati con materiali misti Multistrato rigido, 14 strati con materiali misti

Multilayer 14 layers mixed layup

  • Markets: Military Radar
  • PCB Typology: Multilayer
  • Technologies: Cavities ENIG Bondable Gold 14 layers Mixed materials Green Solder Mask
  • Materials: FR4 High Tg High Frequency Rogers® RO3035 Taconic® RF35A2
Multilayer 8 layer mixed layup Multilayer 8 layer mixed layup Multilayer 8 layer mixed layup Multilayer 8 layer mixed layup

Multilayer 8 layers mixed layup

  • Markets: Telecom
  • PCB Typology: Multilayer
  • Technologies: 8 layers Mixed materials Filled & capped vias Back Drilling ENIG Green Solder Mask
  • Materials: FR4 High Tg Iteq IT180A High Frequency Rogers® RO4350 (Back up material for discontinued 25N & 25FR but partially applicable)
Multistrato, 8 strati con Copper coin interrata Multistrato, 8 strati con Copper coin interrata Multistrato, 8 strati con Copper coin interrata Multistrato, 8 strati con Copper coin interrata

Multilayer 8 layers with embeded copper coin

  • Markets: Military Sea radar Ground radar
  • PCB Typology: Multilayer
  • Technologies: 8 layers Embedded Copper coins Back Drilling Filled & capped vias Mixed materials ENIG Electrolytic soft Gold Blue Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 High Frequency Rogers® RO4350 (Back up material for discontinued 25N & 25FR but partially applicable)
Multilayer 16layer with 6 flex layer Multilayer 16layer with 6 flex layer

Multilayer 16 layers with 6 flex layers

  • Markets: Military Dynamic pointing system
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 16 layers 6 flex layers Electrolytic Nickel on cavities Cavities Wire bondable pads ENIG Electrolytic hard Gold Green Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film
Multilayer 10 layer HDI Multilayer 10 layer HDI Multilayer 10 layer HDI

Multilayer 10 layers HDI

  • Markets: infotainment Smartwatch
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 10 layers HDI SBU Laser vias Stacked vias Buried vias ENIG EMI Shielding Matt Solder Mask Green Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film Tatsuta
Multilayer SBU 3+N+3 Cu filled Multilayer SBU 3+N+3 Cu filled

Multilayer SBU 3+N+3 Cu filled

  • Markets: infotainment Video wall
  • PCB Typology: HDI / Sequential build up (SBU) HDI SBU
  • Technologies: Laser vias Copper filling  Stacked vias Buried vias Filled & capped vias ENEPIG 8 layers 3+N+3 Black Solder Mask
  • Materials: FR4 High Tg Iteq IT180A
Multilayer 10 layer SBU 3+N+3 Laser vias Multilayer 10 layer SBU 3+N+3 Laser vias Multilayer 10 layer SBU 3+N+3 Laser vias

Multilayer 10 layers SBU 3+N+3 Laser vias