Case

Casi d'uso
Multilayer 6 Layer HDI 2+2+2 with laser via Multilayer 6 Layer HDI 2+2+2 with laser via Multilayer 6 Layer HDI 2+2+2 with laser via

Multilayer 6 layers HDI 2+2+2 with laser via

  • Markets: Industrial Automation
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 6 flex layers HDI SBU 2+2+2 Asymmetrical build up Laser vias Copper filling  Staggered vias Buried vias Green Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film Adhesiveless polyimide film
Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm

Multilayer 9 layers 855 mm

  • Markets: Military Radar Ground radar Sea radar
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 9 layers 2 flex layers 500 micron Copper busbar HDI Controlled impedance Laser vias Buried vias 855 mm length ENIG Green Solder Mask
  • Materials: FR4 High Tg Adhesiveless polyimide film
Multilayer 16layer with 6 flex layer Multilayer 16layer with 6 flex layer

Multilayer 16 layers with 6 flex layers

  • Markets: Military Dynamic pointing system
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 16 layers 6 flex layers Electrolytic Nickel on cavities Cavities Wire bondable pads ENIG Electrolytic hard Gold Green Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film
Multilayer 10 layer HDI Multilayer 10 layer HDI Multilayer 10 layer HDI

Multilayer 10 layers HDI

  • Markets: infotainment Smartwatch
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 10 layers HDI SBU Laser vias Stacked vias Buried vias ENIG EMI Shielding Matt Solder Mask Green Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film Tatsuta
Circuiti con Substrato Metallico, mono-faccia, doppia-faccia e multistrato fino a 1,5 mt di lunghezza Circuiti con Substrato Metallico, mono-faccia, doppia-faccia e multistrato fino a 1,5 mt di lunghezza Circuiti con Substrato Metallico, mono-faccia, doppia-faccia e multistrato fino a 1,5 mt di lunghezza

IMS PCB up to 1.5 mt in SS, DS and Multilayer

  • Markets: Lighting Aircraft LED light
  • PCB Typology: Insulated Metal Substrate (IMS) IMS Insulated Metal Substrate IMS Single-side IMS Double-side IMS Multilayer
  • Technologies: up to 1,5 mt long Routing V-scoring Punching ENIG ENEPIG OSP Aluminium plate Copper plate
24 layer, 640 mm long x 4.20 mm thickness 24 layer, 640 mm long x 4.20 mm thickness 24 layer, 640 mm long x 4.20 mm thickness

24 layers, 640 mm long x 4.20 mm thickness

  • Markets: Military Avionic radar
  • PCB Typology: Multilayer
  • Solutions: Power management
  • Technologies: 24 layers Mixed Copper thickness Laser vias Filled & capped vias 640 mm lenght 4.20 mm thickness ENIG Green Solder Mask
  • Materials: FR4 High Tg Iteq IT180A