Case

Casi d'uso
Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch

Ml8–Logic + power on same PCB with fine pitch

  • Markets: Automotive hybrid car
  • PCB Typology: Multilayer
  • Solutions: Logic & power PCB
  • Technologies: 18 layers Mixed Copper thickness Fine pitch ENIG Green Solder Mask
  • Materials: FR4 High Tg Iteq IT180A
SBU with 5+N+5 with Cu filled vias SBU with 5+N+5 with Cu filled vias SBU with 5+N+5 with Cu filled vias SBU with 5+N+5 with Cu filled vias

SBU with 5+N+5 with Cu filled vias

  • Markets: Military Sea radar Ground radar
  • PCB Typology: Multilayer
  • Technologies: 24 layers SBU 5+N+5 Resin filling Electrolytic Nickel on cavities ENIG Green Solder Mask
  • Materials: Polyimide Copper/Invar/Copper
  • Certificates: Integrated Management System Policy
Multistrato, 8 strati con Copper coin interrata Multistrato, 8 strati con Copper coin interrata Multistrato, 8 strati con Copper coin interrata Multistrato, 8 strati con Copper coin interrata

Multilayer 8 layers with embeded copper coin

  • Markets: Military Sea radar Ground radar
  • PCB Typology: Multilayer
  • Technologies: 8 layers Embedded Copper coins Back Drilling Filled & capped vias Mixed materials ENIG Electrolytic soft Gold Blue Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 High Frequency Rogers® RO4350 (Back up material for discontinued 25N & 25FR but partially applicable)