Casi d'uso AllSBUMixed MaterialsMilitaryRigid-Flex PCBsBack DrillingResin FillingStacked ViasMixed FinishesCopper FillingSpecial PCBs Multilayer 8 layers with embeded copper coin Markets: Military Sea radar Ground radar PCB Typology: Multilayer Technologies: 8 layers Embedded Copper coins Back Drilling Filled & capped vias Mixed materials ENIG Electrolytic soft Gold Blue Solder Mask Materials: FR4 High Tg ITEQ IT180 High Frequency Rogers® RO4350 (Back up material for discontinued 25N & 25FR but partially applicable) Pagination Previous page Page 1 Current page 2 Next page
Multilayer 8 layers with embeded copper coin Markets: Military Sea radar Ground radar PCB Typology: Multilayer Technologies: 8 layers Embedded Copper coins Back Drilling Filled & capped vias Mixed materials ENIG Electrolytic soft Gold Blue Solder Mask Materials: FR4 High Tg ITEQ IT180 High Frequency Rogers® RO4350 (Back up material for discontinued 25N & 25FR but partially applicable)
