Case

Casi d'uso
Multilayer 10 layer SBU 3+N+3 Laser vias Multilayer 10 layer SBU 3+N+3 Laser vias Multilayer 10 layer SBU 3+N+3 Laser vias

Multilayer 10 layers SBU 3+N+3 Laser vias

Multilayer 6 layer laser via and UBGA Multilayer 6 layer laser via and UBGA Multilayer 6 layer laser via and UBGA

Multilayer 6 layers laser via and UBGA

  • Markets: Medical
  • PCB Typology: Multilayer
  • Technologies: 6 layers Micro BGA Laser vias Filled & capped vias ENIG Blue Solder Mask
  • Materials: FR4 High Tg Nelco N4000-29
Circuiti con Substrato Metallico, mono-faccia, doppia-faccia e multistrato fino a 1,5 mt di lunghezza Circuiti con Substrato Metallico, mono-faccia, doppia-faccia e multistrato fino a 1,5 mt di lunghezza Circuiti con Substrato Metallico, mono-faccia, doppia-faccia e multistrato fino a 1,5 mt di lunghezza

IMS PCB up to 1.5 mt in SS, DS and Multilayer

  • Markets: Lighting Aircraft LED light
  • PCB Typology: Insulated Metal Substrate (IMS) IMS Insulated Metal Substrate IMS Single-side IMS Double-side IMS Multilayer
  • Technologies: up to 1,5 mt long Routing V-scoring Punching ENIG ENEPIG OSP Aluminium plate Copper plate
24 layer, 640 mm long x 4.20 mm thickness 24 layer, 640 mm long x 4.20 mm thickness 24 layer, 640 mm long x 4.20 mm thickness

24 layers, 640 mm long x 4.20 mm thickness

  • Markets: Military Avionic radar
  • PCB Typology: Multilayer
  • Solutions: Power management
  • Technologies: 24 layers Mixed Copper thickness Laser vias Filled & capped vias 640 mm lenght 4.20 mm thickness ENIG Green Solder Mask
  • Materials: FR4 High Tg Iteq IT180A
Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch Ml8–Logic + power on same PCB with fine pitch

Ml8–Logic + power on same PCB with fine pitch

  • Markets: Automotive hybrid car
  • PCB Typology: Multilayer
  • Solutions: Logic & power PCB
  • Technologies: 18 layers Mixed Copper thickness Fine pitch ENIG Green Solder Mask
  • Materials: FR4 High Tg Iteq IT180A
SBU with 5+N+5 with Cu filled vias SBU with 5+N+5 with Cu filled vias SBU with 5+N+5 with Cu filled vias SBU with 5+N+5 with Cu filled vias

SBU with 5+N+5 with Cu filled vias

  • Markets: Military Sea radar Ground radar
  • PCB Typology: Multilayer
  • Technologies: 24 layers SBU 5+N+5 Resin filling Electrolytic Nickel on cavities ENIG Green Solder Mask
  • Materials: Polyimide Copper/Invar/Copper
  • Certificates: Integrated Management System Policy