Aerospace and Defense

Aerospace and Defense: printed circuit boards for advanced electronics

I nostri numeri

2

PRODUCTION PLANTS IN ITALY

6

ACCREDITED MARKET SECTORS

~50

YEARS OF EXPERIENCE

+160

PEOPLE

+100

APPROVED BASE MATERIALS

5

LANGUAGES SPOKEN

Always a close partner of the Aerospace & Defense market leaders

Choose Cistelaier certified quality

Aerospace & Defense

Our strengths 

  • Specializing in HDI printed circuit boards: maximum efficiency in minimum space for rigid and rigid-flex multilayer circuits
  • PCBs for critical applications: where the highest level of quality and performance is required.
  • Certified for the most demanding markets: Aerospace and Defense, Automotive, Medical Devices, Railway, Industrial Automation.

We’ve been producing printed circuit boards for the aerospace and defense sectors for more than 30 years.  

We have produced printed circuit boards for every conceivable aerospace and military application.

From communication and flight control applications for commercial and military aircraft to radars and antennas used in the maritime sector, not to mention equipment for military personnel.  

Our experience is:

  • solid, with roots in the distant past.
  • Qualified, because it is ISO 9100 certified, an indispensable prerequisite in production for the Avionics & Defense sector.
Aerospace & Defense

We work with many of the leading manufacturers of advanced electronics for air, land and sea applications

Contact us for more information

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CASE

Multistrato rigido, 14 strati con materiali misti Multistrato rigido, 14 strati con materiali misti

Multilayer 14 layers mixed layup

  • Markets: Military Radar
  • PCB Typology: Multilayer
  • Technologies: Cavities ENIG Bondable Gold 14 layers Mixed materials Green Solder Mask
  • Materials: FR4 High Tg High Frequency Rogers® RO3035 Taconic® RF35A2
Multilayer 12L HDI 2+8+2 with laser via Multilayer 12L HDI 2+8+2 with laser via Multilayer 12L HDI 2+8+2 with laser via Multilayer 12L HDI 2+8+2 with laser via Multilayer 12L HDI 2+8+2 with laser via Multilayer 12L HDI 2+8+2 with laser via

Multilayer 12 layers HDI 2+8+2 with laser via

  • Markets: Military Wearable device
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 12 layers HDI SBU 2+8+2 Laser vias Copper filling  Stacked vias Staggered vias Buried vias ENIG Green Solder Mask
  • Materials: High performance Polyimide Resin Ventec VT901 (also No/Low flow) Adhesiveless polyimide film ECCOBOND
Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm Multilayer 9 layer 855 mm

Multilayer 9 layers 855 mm

  • Markets: Military Radar Ground radar Sea radar
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 9 layers 2 flex layers 500 micron Copper busbar HDI Controlled impedance Laser vias Buried vias 855 mm length ENIG Green Solder Mask
  • Materials: FR4 High Tg Adhesiveless polyimide film
Multilayer 16layer with 6 flex layer Multilayer 16layer with 6 flex layer

Multilayer 16 layers with 6 flex layers

  • Markets: Military Dynamic pointing system
  • PCB Typology: Flexible and Flex-Rigid
  • Technologies: 16 layers 6 flex layers Electrolytic Nickel on cavities Cavities Wire bondable pads ENIG Electrolytic hard Gold Green Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 Adhesiveless polyimide film
24 layer, 640 mm long x 4.20 mm thickness 24 layer, 640 mm long x 4.20 mm thickness 24 layer, 640 mm long x 4.20 mm thickness

24 layers, 640 mm long x 4.20 mm thickness

  • Markets: Military Avionic radar
  • PCB Typology: Multilayer
  • Solutions: Power management
  • Technologies: 24 layers Mixed Copper thickness Laser vias Filled & capped vias 640 mm lenght 4.20 mm thickness ENIG Green Solder Mask
  • Materials: FR4 High Tg Iteq IT180A
SBU with 5+N+5 with Cu filled vias SBU with 5+N+5 with Cu filled vias SBU with 5+N+5 with Cu filled vias SBU with 5+N+5 with Cu filled vias

SBU with 5+N+5 with Cu filled vias

  • Markets: Military Sea radar Ground radar
  • PCB Typology: Multilayer
  • Technologies: 24 layers SBU 5+N+5 Resin filling Electrolytic Nickel on cavities ENIG Green Solder Mask
  • Materials: Polyimide Copper/Invar/Copper
  • Certificates: Integrated Management System Policy
Multistrato, 8 strati con Copper coin interrata Multistrato, 8 strati con Copper coin interrata Multistrato, 8 strati con Copper coin interrata Multistrato, 8 strati con Copper coin interrata

Multilayer 8 layers with embeded copper coin

  • Markets: Military Sea radar Ground radar
  • PCB Typology: Multilayer
  • Technologies: 8 layers Embedded Copper coins Back Drilling Filled & capped vias Mixed materials ENIG Electrolytic soft Gold Blue Solder Mask
  • Materials: FR4 High Tg ITEQ IT180 High Frequency Rogers® RO4350 (Back up material for discontinued 25N & 25FR but partially applicable)